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AS1123
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD to GND
Input Voltage
Output Voltage
0
-0.4
-0.4
7
V DD +0.4
7
V
V
V
GND Pin Current
2000
2800
mA
mA
24-pin QSOP package
24-pin TQFN (4x4mm) package
Input Current (latch-up immunity)
-100
+100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM
+/- 1
kV
Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Thermal Resistance Θ JA
Junction Temperature
88
23
150
oC/W
oC/W
°C
on PCB, 24-pin QSOP package
on PCB, 24-pin TQFN (4x4mm) package
Storage Temperature
-55
150
oC
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-020
Package Body Temperature
+260
oC
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity
5
85
%
Non-condensing
Moisture Sensitive Level
www.austriamicrosystems.com/LED-Driver-ICs
3
Revision 1.00
Represents a max. floor life time of 168h
3 - 24
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